The Tensor G3 chip, which is reportedly made by Samsung and is based on its Exynos 2400, could be the first Samsung Foundry chip to incorporate FO-WLP (Fan-out wafer-level packaging) packaging. This enhanced wafer-level packaging will, in theory, allow for better efficiency, improved graphics performance, and more energy being saved.
FO-WLP has been used by Qualcomm and MediaTek, but this is supposedly the first time Samsung Foundry is using the tech.
The 4nm Tensor G3 will be inside the Pixel 8 and Pixel 8 Pro and will have a 9-core CPU – one Cortex-X3 prime core, four Cortex-A715s, and four Cortex-A510s. For graphics, it will use the 10-core Arm Immortalis G715 GPU – up from the 7-core G710.
The Pixel 8 series will arrive on October 4.
The Tensor G3 is the first among Samsung Foundry’s smartphone chips to incorporate FO-WLP packaging, which is expected to reduce heat generation and increase power efficiency for the Tensor G3.
— Revegnus (@Tech_Reve) September 11, 2023